Stop the war!
Остановите войну!
for scientists:
default search action
"Analysis and Test of PCB via Hole Heat Dissipation Performance in Circuit ..."
Min Wang et al. (2021)
- Min Wang, Mengrou Feng, Xikun Lu, Ran Wei:
Analysis and Test of PCB via Hole Heat Dissipation Performance in Circuit Practice Course. DSDE 2021: 161-165
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.