BibTeX record conf/3dic/NoiaC11

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@inproceedings{DBLP:conf/3dic/NoiaC11,
  author       = {Brandon Noia and
                  Krishnendu Chakrabarty},
  editor       = {Mitsumasa Koyanagi and
                  Morihiro Kada},
  title        = {Pre-bond testing of die logic and TSVs in high performance 3D-SICs},
  booktitle    = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
                  Osaka, Japan, January 31 - February 2, 2012},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2011},
  url          = {https://doi.org/10.1109/3DIC.2012.6263042},
  doi          = {10.1109/3DIC.2012.6263042},
  timestamp    = {Mon, 03 Jan 2022 22:17:10 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/NoiaC11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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