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BibTeX record conf/3dic/MurugesanSSMKF23
@inproceedings{DBLP:conf/3dic/MurugesanSSMKF23, author = {Mariappan Murugesan and M. Sawa and E. Sone and Makoto Motoyoshi and Mitsumasa Koyanagi and Takafumi Fukushima}, title = {Copper Electrode Surface Features and Cu-SiO2Hybrid Bonding}, booktitle = {{IEEE} International 3D Systems Integration Conference, 3DIC 2023, Cork, Ireland, May 10-12, 2023}, pages = {1--4}, publisher = {{IEEE}}, year = {2023}, url = {https://doi.org/10.1109/3DIC57175.2023.10154924}, doi = {10.1109/3DIC57175.2023.10154924}, timestamp = {Mon, 10 Jul 2023 15:09:43 +0200}, biburl = {https://dblp.org/rec/conf/3dic/MurugesanSSMKF23.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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