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"Copper Electrode Surface Features and Cu-SiO2Hybrid Bonding."

Mariappan Murugesan et al. (2023)

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DOI: 10.1109/3DIC57175.2023.10154924

access: closed

type: Conference or Workshop Paper

metadata version: 2023-07-10

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  dblp key:
  - conf/3dic/MurugesanSSMKF23
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  - https://dblp.org/rec/conf/3dic/MurugesanSSMKF23
Mariappan Murugesan, M. Sawa, E. Sone, Makoto Motoyoshi, Mitsumasa Koyanagi, Takafumi Fukushima:
Copper Electrode Surface Features and Cu-SiO2Hybrid Bonding. 3DIC 2023: 1-4

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