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BibTeX record conf/3dic/MiwaLLKKFT19
@inproceedings{DBLP:conf/3dic/MiwaLLKKFT19, author = {Yuki Miwa and Sungho Lee and Rui Liang and Kousei Kumahara and Hisashi Kino and Takafumi Fukushima and Tetsu Tanaka}, title = {Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs}, booktitle = {2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019}, pages = {1--4}, publisher = {{IEEE}}, year = {2019}, url = {https://doi.org/10.1109/3DIC48104.2019.9058841}, doi = {10.1109/3DIC48104.2019.9058841}, timestamp = {Thu, 14 Oct 2021 09:53:40 +0200}, biburl = {https://dblp.org/rec/conf/3dic/MiwaLLKKFT19.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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