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"Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch ..."

Yuki Miwa et al. (2019)

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DOI: 10.1109/3DIC48104.2019.9058841

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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  dblp key:
  - conf/3dic/MiwaLLKKFT19
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  - https://dblp.org/rec/conf/3dic/MiwaLLKKFT19
Yuki Miwa, Sungho Lee, Rui Liang, Kousei Kumahara, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka:
Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs. 3DIC 2019: 1-4

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