BibTeX record conf/3dic/MatsumotoMO14

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@inproceedings{DBLP:conf/3dic/MatsumotoMO14,
  author       = {Keiji Matsumoto and
                  Hiroyuki Mori and
                  Yasumitsu Orii},
  title        = {Cooling from the bottom side (laminate (substrate) side) of a three-dimensional
                  {(3D)} chip stack},
  booktitle    = {2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale,
                  Ireland, December 1-3, 2014},
  pages        = {1--6},
  publisher    = {{IEEE}},
  year         = {2014},
  url          = {https://doi.org/10.1109/3DIC.2014.7152164},
  doi          = {10.1109/3DIC.2014.7152164},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/MatsumotoMO14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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