BibTeX record conf/3dic/LiXOBHHCK11

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@inproceedings{DBLP:conf/3dic/LiXOBHHCK11,
  author       = {H. Y. Li and
                  L. Xie and
                  L. G. Ong and
                  A. Baram and
                  I. Herer and
                  Arnon Hirshberg and
                  S. C. Chong and
                  D. L. Kwong},
  editor       = {Mitsumasa Koyanagi and
                  Morihiro Kada},
  title        = {Ultra-compact micro-coil realized via multilevel dense {TSV} coil
                  for MEMs application},
  booktitle    = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
                  Osaka, Japan, January 31 - February 2, 2012},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2011},
  url          = {https://doi.org/10.1109/3DIC.2012.6263008},
  doi          = {10.1109/3DIC.2012.6263008},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/LiXOBHHCK11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}