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BibTeX record conf/3dic/LeeBFOTK11
@inproceedings{DBLP:conf/3dic/LeeBFOTK11, author = {Kang Wook Lee and Jichoel Bea and Takafumi Fukushima and Yuki Ohara and Tetsu Tanaka and Mitsumasa Koyanagi}, editor = {Mitsumasa Koyanagi and Morihiro Kada}, title = {High reliable and fine size of 5-{\(\mu\)}m diameter backside Cu through-silicon Via(TSV) for high reliability and high-end 3-D LSIs}, booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012}, pages = {1--4}, publisher = {{IEEE}}, year = {2011}, url = {https://doi.org/10.1109/3DIC.2012.6262975}, doi = {10.1109/3DIC.2012.6262975}, timestamp = {Tue, 16 Feb 2021 15:53:52 +0100}, biburl = {https://dblp.org/rec/conf/3dic/LeeBFOTK11.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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