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BibTeX record conf/3dic/JourdainBPPWSBBTS10
@inproceedings{DBLP:conf/3dic/JourdainBPPWSBBTS10, author = {Anne Jourdain and Thibault Buisson and Alain Phommahaxay and Mark Privett and Dan Wallace and Sumant Sood and Peter Bisson and Eric Beyne and Youssef Travaly and Bart Swinnen}, title = {300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked {IC} applications}, booktitle = {{IEEE} International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010}, pages = {1--4}, publisher = {{IEEE}}, year = {2010}, url = {https://doi.org/10.1109/3DIC.2010.5751468}, doi = {10.1109/3DIC.2010.5751468}, timestamp = {Thu, 14 Oct 2021 09:53:40 +0200}, biburl = {https://dblp.org/rec/conf/3dic/JourdainBPPWSBBTS10.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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