BibTeX record conf/3dic/JourdainBPPWSBBTS10

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@inproceedings{DBLP:conf/3dic/JourdainBPPWSBBTS10,
  author       = {Anne Jourdain and
                  Thibault Buisson and
                  Alain Phommahaxay and
                  Mark Privett and
                  Dan Wallace and
                  Sumant Sood and
                  Peter Bisson and
                  Eric Beyne and
                  Youssef Travaly and
                  Bart Swinnen},
  title        = {300mm wafer thinning and backside passivation compatibility with temporary
                  wafer bonding for 3D stacked {IC} applications},
  booktitle    = {{IEEE} International Conference on 3D System Integration, 3DIC 2010,
                  Munich, Germany, 16-18 November 2010},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2010},
  url          = {https://doi.org/10.1109/3DIC.2010.5751468},
  doi          = {10.1109/3DIC.2010.5751468},
  timestamp    = {Thu, 14 Oct 2021 09:53:40 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/JourdainBPPWSBBTS10.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}