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BibTeX record conf/3dic/ChenXLKCHLCHKFCLL11
@inproceedings{DBLP:conf/3dic/ChenXLKCHLCHKFCLL11, author = {Kuan{-}Neng Chen and Z. Xu and Fei Liu and Cheng{-}Ta Ko and Chuan{-}An Cheng and W. C. Huang and H. L. Lin and C. Cabral and Zhi{-}Cheng Hsiao and N. Klymko and Hsin{-}Chia Fu and Y. H. Chen and Jian{-}Qiang Lu and Wei{-}Chung Lo}, editor = {Mitsumasa Koyanagi and Morihiro Kada}, title = {Cu-based bonding technology for 3D integration applications}, booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012}, pages = {1--4}, publisher = {{IEEE}}, year = {2011}, url = {https://doi.org/10.1109/3DIC.2012.6262974}, doi = {10.1109/3DIC.2012.6262974}, timestamp = {Sat, 20 Apr 2024 16:08:53 +0200}, biburl = {https://dblp.org/rec/conf/3dic/ChenXLKCHLCHKFCLL11.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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