BibTeX record conf/3dic/ChenXLKCHLCHKFCLL11

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@inproceedings{DBLP:conf/3dic/ChenXLKCHLCHKFCLL11,
  author       = {Kuan{-}Neng Chen and
                  Z. Xu and
                  Fei Liu and
                  Cheng{-}Ta Ko and
                  Chuan{-}An Cheng and
                  W. C. Huang and
                  H. L. Lin and
                  C. Cabral and
                  Zhi{-}Cheng Hsiao and
                  N. Klymko and
                  Hsin{-}Chia Fu and
                  Y. H. Chen and
                  Jian{-}Qiang Lu and
                  Wei{-}Chung Lo},
  editor       = {Mitsumasa Koyanagi and
                  Morihiro Kada},
  title        = {Cu-based bonding technology for 3D integration applications},
  booktitle    = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
                  Osaka, Japan, January 31 - February 2, 2012},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2011},
  url          = {https://doi.org/10.1109/3DIC.2012.6262974},
  doi          = {10.1109/3DIC.2012.6262974},
  timestamp    = {Sat, 20 Apr 2024 16:08:53 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/ChenXLKCHLCHKFCLL11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}