BibTeX record conf/3dic/BlasaMMLPHY16

download as .bib file

@inproceedings{DBLP:conf/3dic/BlasaMMLPHY16,
  author       = {Reynard Blasa and
                  Brian Mattis and
                  Dave Martini and
                  Sidi Lanee and
                  Carl Petteway and
                  Sangki Hong and
                  Kangsoo Yi},
  title        = {High density backside tungsten {TSV} for 3D stacked ICs},
  booktitle    = {2016 {IEEE} International 3D Systems Integration Conference, 3DIC
                  2016, San Francisco, CA, USA, November 8-11, 2016},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2016},
  url          = {https://doi.org/10.1109/3DIC.2016.7970020},
  doi          = {10.1109/3DIC.2016.7970020},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/BlasaMMLPHY16.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
a service of  Schloss Dagstuhl - Leibniz Center for Informatics

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.