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BibTeX record conf/3dic/BlasaMMLPHY16
@inproceedings{DBLP:conf/3dic/BlasaMMLPHY16, author = {Reynard Blasa and Brian Mattis and Dave Martini and Sidi Lanee and Carl Petteway and Sangki Hong and Kangsoo Yi}, title = {High density backside tungsten {TSV} for 3D stacked ICs}, booktitle = {2016 {IEEE} International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016}, pages = {1--4}, publisher = {{IEEE}}, year = {2016}, url = {https://doi.org/10.1109/3DIC.2016.7970020}, doi = {10.1109/3DIC.2016.7970020}, timestamp = {Wed, 16 Oct 2019 14:14:50 +0200}, biburl = {https://dblp.org/rec/conf/3dic/BlasaMMLPHY16.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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