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"High density backside tungsten TSV for 3D stacked ICs."
Reynard Blasa et al. (2016)
- Reynard Blasa, Brian Mattis, Dave Martini, Sidi Lanee, Carl Petteway, Sangki Hong, Kangsoo Yi:
High density backside tungsten TSV for 3D stacked ICs. 3DIC 2016: 1-4
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