Wu-Tung Cheng

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

◀ ▶ joint publications with Li-Ren Huang

> Home > Persons > Wu-Tung Cheng

Publications

2014
[j18]
- view
  authority control:
- export record
  dblp key:
  - journals/tcad/HuangHTC14
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tcad/HuangHTC14
Li-Ren Huang, Shi-Yu Huang, Kun-Han Tsai, Wu-Tung Cheng:
Parametric Fault Testing and Performance Characterization of Post-Bond Interposer Wires in 2.5-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 33(3): 476-488 (2014)
2013
[j14]
- view
  authority control:
- export record
  dblp key:
  - journals/tcad/HuangLHTC13
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tcad/HuangLHTC13
Shi-Yu Huang, Yu-Hsiang Lin, Li-Ren Huang, Kun-Han Tsai, Wu-Tung Cheng:
Programmable Leakage Test and Binning for TSVs With Self-Timed Timing Control. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 32(8): 1265-1273 (2013)
[j13]
- view
  authority control:
- export record
  dblp key:
  - journals/tcad/HuangHSTC13
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tcad/HuangHSTC13
Li-Ren Huang, Shi-Yu Huang, Stephen K. Sunter, Kun-Han Tsai, Wu-Tung Cheng:
Oscillation-Based Prebond TSV Test. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 32(9): 1440-1444 (2013)
[c98]
- view
  authority control:
- export record
  dblp key:
  - conf/ats/HuangHTCS13
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/ats/HuangHTCS13
Li-Ren Huang, Shi-Yu Huang, Kun-Han Tsai, Wu-Tung Cheng, Stephen K. Sunter:
Mid-bond Interposer Wire Test. Asian Test Symposium 2013: 153-158
[c96]
- view
  authority control:
- export record
  dblp key:
  - conf/itc/HuangHTC13
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/itc/HuangHTC13
Shi-Yu Huang, Li-Ren Huang, Kun-Han Tsai, Wu-Tung Cheng:
Delay testing and characterization of post-bond interposer wires in 2.5-D ICs. ITC 2013: 1-8

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.