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export results for "Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates."
@article{DBLP:journals/tr/WildGLZ17, author = {Paul Wild and Tobias Gr{\"{o}}zinger and Dominik Lorenz and Andr{\'{e}} Zimmermann}, title = {Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on {MID} and {PCB} Substrates}, journal = {{IEEE} Trans. Reliab.}, volume = {66}, number = {4}, pages = {1229--1237}, year = {2017}, url = {https://doi.org/10.1109/TR.2017.2759231}, doi = {10.1109/TR.2017.2759231}, timestamp = {Thu, 09 Jul 2020 01:00:00 +0200}, biburl = {https://dblp.org/rec/journals/tr/WildGLZ17.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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