Search dblp for Publications

export results for "A 3D SoC design for H.264 application with on-chip DRAM stacking"

 download as .bib file

@inproceedings{DBLP:conf/3dic/ZhangWFCLSXSDXCL10,
  author       = {Tao Zhang and
                  Kui Wang and
                  Yi Feng and
                  Yan Chen and
                  Qun Li and
                  Bing Shao and
                  Jing Xie and
                  Xiaodi Song and
                  Lian Duan and
                  Yuan Xie and
                  Xu Cheng and
                  Youn{-}Long Lin},
  title        = {A 3D SoC design for {H.264} application with on-chip {DRAM} stacking},
  booktitle    = {{IEEE} International Conference on 3D System Integration, 3DIC 2010,
                  Munich, Germany, 16-18 November 2010},
  pages        = {1--6},
  publisher    = {{IEEE}},
  year         = {2010},
  url          = {https://doi.org/10.1109/3DIC.2010.5751446},
  doi          = {10.1109/3DIC.2010.5751446},
  timestamp    = {Fri, 07 Feb 2020 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/ZhangWFCLSXSDXCL10.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
a service of  Schloss Dagstuhl - Leibniz Center for Informatics

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.