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@inproceedings{DBLP:conf/irps/RanjanROMBSP18, author = {Alok Ranjan and Nagarajan Raghavan and Sean J. O'Shea and Sen Mei and Michel Bosman and Kalya Shubhakar and Kin Leong Pey}, title = {Mechanism of soft and hard breakdown in hexagonal boron nitride 2D dielectrics}, booktitle = {{IEEE} International Reliability Physics Symposium, {IRPS} 2018, Burlingame, CA, USA, March 11-15, 2018}, pages = {4}, publisher = {{IEEE}}, year = {2018}, url = {https://doi.org/10.1109/IRPS.2018.8353574}, doi = {10.1109/IRPS.2018.8353574}, timestamp = {Tue, 21 Mar 2023 00:00:00 +0100}, biburl = {https://dblp.org/rec/conf/irps/RanjanROMBSP18.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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