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@inproceedings{DBLP:conf/isscc/OhCBKKRPKCSLSHC20,
  author       = {Chi{-}Sung Oh and
                  Ki Chul Chun and
                  Young{-}Yong Byun and
                  Yong{-}Ki Kim and
                  So{-}Young Kim and
                  Yesin Ryu and
                  Jaewon Park and
                  Sinho Kim and
                  Sang{-}uhn Cha and
                  Dong{-}Hak Shin and
                  Jungyu Lee and
                  Jong{-}Pil Son and
                  Byung{-}Kyu Ho and
                  Seong{-}Jin Cho and
                  Beomyong Kil and
                  Sungoh Ahn and
                  Baekmin Lim and
                  Yong{-}Sik Park and
                  Kijun Lee and
                  Myung{-}Kyu Lee and
                  Seungduk Baek and
                  Junyong Noh and
                  Jae{-}Wook Lee and
                  Seungseob Lee and
                  Sooyoung Kim and
                  Bo{-}Tak Lim and
                  Seouk{-}Kyu Choi and
                  Jin{-}Guk Kim and
                  Hye{-}In Choi and
                  Hyuk{-}Jun Kwon and
                  Jun Jin Kong and
                  Kyomin Sohn and
                  Nam Sung Kim and
                  Kwang{-}Il Park and
                  Jung{-}Bae Lee},
  title        = {22.1 {A} 1.1V 16GB 640GB/s {HBM2E} {DRAM} with a Data-Bus Window-Extension
                  Technique and a Synergetic On-Die {ECC} Scheme},
  booktitle    = {{ISSCC}},
  pages        = {330--332},
  publisher    = {{IEEE}},
  year         = {2020}
}

@inproceedings{DBLP:conf/hpca/ChaOSHPJCJSCAK17,
  author       = {Sang{-}uhn Cha and
                  Seongil O and
                  Hyunsung Shin and
                  Sangjoon Hwang and
                  Kwang{-}Il Park and
                  Seong{-}Jin Jang and
                  Joo{-}Sun Choi and
                  Gyo{-}Young Jin and
                  Young Hoon Son and
                  Hyunyoon Cho and
                  Jung Ho Ahn and
                  Nam Sung Kim},
  title        = {Defect Analysis and Cost-Effective Resilience Architecture for Future
                  {DRAM} Devices},
  booktitle    = {{HPCA}},
  pages        = {61--72},
  publisher    = {{IEEE} Computer Society},
  year         = {2017}
}

@inproceedings{DBLP:conf/wsc/AhnP17,
  author       = {Ki Uhn Ahn and
                  Cheol{-}Soo Park},
  title        = {Artificial neural network models for building energy prediction},
  booktitle    = {{WSC}},
  pages        = {2708--2716},
  publisher    = {{IEEE}},
  year         = {2017}
}