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@inproceedings{DBLP:conf/3dic/AhmedC13,
author = {Mohammad A. Ahmed and
Malgorzata Chrzanowska{-}Jeske},
title = {{TSV} capacitance aware 3-D floorplanning},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--6},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702358},
doi = {10.1109/3DIC.2013.6702358},
timestamp = {Wed, 16 Oct 2019 14:14:50 +0200},
biburl = {https://dblp.org/rec/conf/3dic/AhmedC13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/AoyagiWSKNAISS13,
author = {Masahiro Aoyagi and
Naoya Watanabe and
Motohiro Suzuki and
Katsuya Kikuchi and
Shunsuke Nemoto and
Noriaki Arima and
Misaki Ishizuka and
Koji Suzuki and
Toshio Shiomi},
title = {New optical three dimensional structure measurement method of cone
shape micro bumps used for 3D {LSI} chip stacking},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--5},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702388},
doi = {10.1109/3DIC.2013.6702388},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/AoyagiWSKNAISS13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/AzarkhishLB13,
author = {Erfan Azarkhish and
Igor Loi and
Luca Benini},
title = {A high-performance multiported {L2} memory {IP} for scalable three-dimensional
integration},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--8},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702347},
doi = {10.1109/3DIC.2013.6702347},
timestamp = {Fri, 27 Mar 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/AzarkhishLB13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/BeilliardCCMSMSEP13,
author = {Yann Beilliard and
Perceval Coudrain and
L{\'{e}}a Di Cioccio and
St{\'{e}}phane Moreau and
Loic Sanchez and
Brigitte Montmayeul and
Thomas Signamarcheix and
Rafael Estevez and
Guillaume Parry},
title = {Chip to wafer copper direct bonding electrical characterization and
thermal cycling},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--7},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702315},
doi = {10.1109/3DIC.2013.6702315},
timestamp = {Thu, 21 Jan 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/BeilliardCCMSMSEP13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/BieniekJDSEGJZ13,
author = {Tomasz Bieniek and
Grzegorz Janczyk and
Rafal Dobrowolski and
Dariusz Szmigiel and
Magdalena Ekwinska and
Piotr Grabiec and
Pawel Janus and
Jerzy Zajac},
title = {Dedicated MEMS-based test structure for 3D SiP interconnects reliability
investigation},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--6},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702375},
doi = {10.1109/3DIC.2013.6702375},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/BieniekJDSEGJZ13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/BrocardBLFMSLCF13,
author = {Melanie Brocard and
C{\'{e}}dric Bermond and
Thierry Lacrevaz and
Alexis Farcy and
Patrick Le Maitre and
P. Scheer and
Patrick Leduc and
S{\'{e}}verine Cheramy and
Bernard Fl{\'{e}}chet},
title = {{RF} characterization of substrate coupling between {TSV} and {MOS}
transistors in 3D integrated circuits},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--8},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702331},
doi = {10.1109/3DIC.2013.6702331},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/BrocardBLFMSLCF13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/ChenLHCTCCCCHLLKK13,
author = {Jui{-}Chin Chen and
John H. Lau and
Tzu{-}Chien Hsu and
Chien{-}Chou Chen and
Pei{-}Jer Tzeng and
Po{-}Chih Chang and
Chun{-}Hsien Chien and
Yiu{-}Hsiang Chang and
Shang{-}Chun Chen and
Yu{-}Chen Hsin and
Sue{-}Chen Liao and
Cha{-}Hsin Lin and
Tzu{-}Kun Ku and
Ming{-}Jer Kao},
title = {Challenges of Cu {CMP} of TSVs and RDLs fabricated from the backside
of a thin wafer},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--5},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702335},
doi = {10.1109/3DIC.2013.6702335},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/ChenLHCTCCCCHLLKK13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/ChewMBMN13,
author = {Jason Chew and
Uday Mahajan and
Rajeev Bajaj and
Iad Mirshad and
Robert Newcomb},
title = {Characterization and optimization of a {TSV} {CMP} reveal process
using a novel wafer inspection technique for detecting sub-monolayer
surface contamination},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--6},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702318},
doi = {10.1109/3DIC.2013.6702318},
timestamp = {Mon, 16 Oct 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/ChewMBMN13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/ChewMBMN13a,
author = {Jason Chew and
Uday Mahajan and
Rajeev Bajaj and
Iad Mirshad and
Robert Newcomb},
title = {Characterization and optimization of a {TSV} {CMP} reveal process
using a novel wafer inspection technique for detecting sub-monolayer
surface contamination},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--6},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702372},
doi = {10.1109/3DIC.2013.6702372},
timestamp = {Mon, 16 Oct 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/ChewMBMN13a.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/ChienYLLCZCLHCFLSKLL13,
author = {Chun{-}Hsien Chien and
Hsun Yu and
Ching{-}Kuan Lee and
Yu{-}Min Lin and
Ren{-}Shin Cheng and
Chau{-}Jie Zhan and
Peng{-}Shu Chen and
Chang{-}Chih Liu and
Chao{-}Kai Hsu and
Hsiang{-}Hung Chang and
Huan{-}Chun Fu and
Yuan{-}Chang Lee and
Wen{-}Wei Shen and
Cheng{-}Ta Ko and
Wei{-}Chung Lo and
Yung Jean Lu},
title = {Performance and process characteristic of glass interposer with through-glass-via(TGV)},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--7},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702380},
doi = {10.1109/3DIC.2013.6702380},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/ChienYLLCZCLHCFLSKLL13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/ChoKKST13,
author = {Jonghyun Cho and
Youngwoo Kim and
Joungho Kim and
Venky Sundaram and
Rao R. Tummala},
title = {Analysis of glass interposer {PDN} and proposal of {PDN} resonance
suppression methods},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--5},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702320},
doi = {10.1109/3DIC.2013.6702320},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/ChoKKST13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/ChoKKST13a,
author = {Jonghyun Cho and
Youngwoo Kim and
Joungho Kim and
Venky Sundaram and
Rao R. Tummala},
title = {Analysis of glass interposer {PDN} and proposal of {PDN} resonance
suppression methods},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--5},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702391},
doi = {10.1109/3DIC.2013.6702391},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/ChoKKST13a.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/CibrarioHCCBAGG13,
author = {Gerald Cibrario and
David Henry and
Chantal Chantre and
Robert Cuchet and
Robert Berthelot and
Karim Azizi{-}Mourier and
Marjorie Gary and
Fabien Gays},
title = {A 3D Process Design Kit generator based on customizable 3D layout
design environment},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--5},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702324},
doi = {10.1109/3DIC.2013.6702324},
timestamp = {Fri, 09 Jun 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/CibrarioHCCBAGG13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/CivaleMJFYWKRL13,
author = {Yann Civale and
Herman Meynen and
Ranjith S. E. John and
Peng{-}Fei Fu and
Craig R. Yeakle and
Sheng Wang and
Stefan Krausse and
Thomas Rapps and
Stefan Lutter},
title = {Cost-effective temporary bonding and debonding material solution towards
high-volume manufacturing 2.5D/3D through-silicon via integrated circuits},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--5},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702330},
doi = {10.1109/3DIC.2013.6702330},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/CivaleMJFYWKRL13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/EbeforsFPDCKRV13,
author = {Thorbjorn Ebefors and
Jessica Fredlund and
Daniel Perttu and
Raymond van Dijk and
Lorenzo Cifola and
Mikko Kaunisto and
Pekka Rantakari and
Tauno Vaha{-}Heikkila},
title = {The development and evaluation of {RF} {TSV} for 3D {IPD} applications},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--8},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702382},
doi = {10.1109/3DIC.2013.6702382},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/EbeforsFPDCKRV13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/EgawaSTK13,
author = {Ryusuke Egawa and
Masayuki Sato and
Jubee Tada and
Hiroaki Kobayashi},
title = {Vertically integrated processor and memory module design for vector
supercomputers},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--6},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702377},
doi = {10.1109/3DIC.2013.6702377},
timestamp = {Fri, 27 Dec 2019 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/EgawaSTK13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/FranzonB13,
author = {Paul D. Franzon and
Avi Bar{-}Cohen},
title = {Thermal requirements in future 3D processors},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--6},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702402},
doi = {10.1109/3DIC.2013.6702402},
timestamp = {Sat, 19 Oct 2019 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/FranzonB13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/Fuentes13,
author = {Ricardo I. Fuentes},
title = {Wafer thinning for 3D integration},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--5},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702381},
doi = {10.1109/3DIC.2013.6702381},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/Fuentes13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/FukushimaBMLK13,
author = {Takafumi Fukushima and
Jichoel Bea and
Mariappan Murugesan and
Kang Wook Lee and
Mitsumasa Koyanagi},
title = {Development of via-last 3D integration technologies using a new temporary
adhesive system},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--4},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702383},
doi = {10.1109/3DIC.2013.6702383},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/FukushimaBMLK13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/FukushimaBMSSBKLK13,
author = {Takafumi Fukushima and
Jichoel Bea and
Mariappan Murugesan and
Ho{-}Young Son and
M.{-}S. Suh and
K.{-}Y. Byun and
N.{-}S. Kim and
Kang Wook Lee and
Mitsumasa Koyanagi},
title = {3D memory chip stacking by multi-layer self-assembly technology},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--4},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702360},
doi = {10.1109/3DIC.2013.6702360},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/FukushimaBMSSBKLK13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/GhoshYTT13,
author = {Kaushik Ghosh and
C. C. Yap and
Beng Kang Tay and
Chuan Seng Tan},
title = {Integration of {CNT} in {TSV} ({\(\leq\)}5 {\(\mu\)}m) for 3D {IC}
application and its process challenges},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--4},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702369},
doi = {10.1109/3DIC.2013.6702369},
timestamp = {Thu, 20 Jan 2022 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/GhoshYTT13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/GopeCACPC13,
author = {Dipanjan Gope and
S. Chatterjee and
D. de Araujo and
Swagato Chakraborty and
James Pingenot and
Raul Camposano},
title = {Device physics aware 3D electromagnetic simulation of Through-Silicon-Vias
in system modeling},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--5},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702340},
doi = {10.1109/3DIC.2013.6702340},
timestamp = {Tue, 13 Jun 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/GopeCACPC13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/GopiD13,
author = {Neela Gopi and
Jeffrey Draper},
title = {Techniques for assigning inter-tier signals to bondpoints in a face-to-face
bonded 3DIC},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--6},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702384},
doi = {10.1109/3DIC.2013.6702384},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/GopiD13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/HashimotoFLKT13,
author = {Hiroyuki Hashimoto and
Takafumi Fukushima and
Kang Wook Lee and
Mitsumasa Koyanagi and
Tetsu Tanaka},
title = {Highly efficient {TSV} repair technology for resilient 3-D stacked
multicore processor system},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--5},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702338},
doi = {10.1109/3DIC.2013.6702338},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/HashimotoFLKT13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/Heinig13,
author = {Andy Heinig},
title = {Layout dependent synthesis for manufacturing costs optimized 3D integrated
systems},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--6},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702349},
doi = {10.1109/3DIC.2013.6702349},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/Heinig13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/HossainHYC13,
author = {Nahid M. Hossain and
MunEm Hossain and
Abdul Hamid Bin Yousuf and
Masud H. Chowdhury},
title = {Thermal aware Graphene based Through Silicon Via design for 3D {IC}},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--4},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702385},
doi = {10.1109/3DIC.2013.6702385},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/HossainHYC13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/HuangTCSLCCHCTC13,
author = {Yan{-}Pin Huang and
Ruoh{-}Ning Tzeng and
Yu{-}San Chien and
Ming{-}Shaw Shy and
Teu{-}Hua Lin and
Kuo{-}Hua Chen and
Ching{-}Te Chuang and
Wei Hwang and
Chi{-}Tsung Chiu and
Ho{-}Ming Tong and
Kuan{-}Neng Chen},
title = {Low temperature ({\textless}180 {\textdegree}C) bonding for 3D integration},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--5},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702319},
doi = {10.1109/3DIC.2013.6702319},
timestamp = {Sat, 16 Sep 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/HuangTCSLCCHCTC13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/IkedaQNA13,
author = {Akihiro Ikeda and
L. J. Qiu and
K. Nakahara and
Tanemasa Asano},
title = {Surface passivation of Cu cone bump by self-assembled-monolayer for
room temperature Cu-Cu bonding},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--4},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702317},
doi = {10.1109/3DIC.2013.6702317},
timestamp = {Fri, 07 Jun 2019 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/IkedaQNA13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/JoblotFHJCGAFCFLC13,
author = {Sylvain Joblot and
Alexis Farcy and
Nicolas Hotellier and
Amadine Jouve and
Fran{\c{c}}ois de Crecy and
Arnaud Garnier and
M. Argoud and
C. Ferrandon and
J.{-}P. Colonna and
R. Franiatte and
C. Laviron and
S{\'{e}}verine Cheramy},
title = {Wafer level encapsulated materials evaluation for chip on wafer (CoW)
approach in 2.5D Si interposer integration},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--7},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702394},
doi = {10.1109/3DIC.2013.6702394},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/JoblotFHJCGAFCFLC13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/JungCKKKKBC13,
author = {Daniel H. Jung and
Jonghyun Cho and
Heegon Kim and
Jonghoon J. Kim and
Hongseok Kim and
Joungho Kim and
Hyun{-}Cheol Bae and
Kwang{-}Seong Choi},
title = {Fault isolation of short defect in through silicon via {(TSV)} based
3D-IC},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--4},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702376},
doi = {10.1109/3DIC.2013.6702376},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/JungCKKKKBC13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KikuchiKNNAYK13,
author = {Katsuya Kikuchi and
Fumiki Kato and
Shunsuke Nemoto and
Hiroshi Nakagawa and
Masahiro Aoyagi and
Youtaro Yasu and
Kohji Koshiji},
title = {Investigation of optimized high-density flip-chip interconnect design
including micro Au bumps for 3-D stacked {LSI} packaging},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--4},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702401},
doi = {10.1109/3DIC.2013.6702401},
timestamp = {Fri, 02 Nov 2018 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/KikuchiKNNAYK13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KimCKJCKLP13,
author = {Heegon Kim and
Jonghyun Cho and
Jonghoon J. Kim and
Daniel H. Jung and
Sumin Choi and
Joungho Kim and
Junho Lee and
Kunwoo Park},
title = {Eye-diagram simulation and analysis of a high-speed TSV-based channel},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--7},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702327},
doi = {10.1109/3DIC.2013.6702327},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/KimCKJCKLP13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KimKKBJKKLP13,
author = {Jonghoon J. Kim and
Heegon Kim and
Sukjin Kim and
Bumhee Bae and
Daniel H. Jung and
Sunkyu Kong and
Joungho Kim and
Junho Lee and
Kunwoo Park},
title = {Non-contact wafer-level {TSV} connectivity test methodology using
magnetic coupling},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--4},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702328},
doi = {10.1109/3DIC.2013.6702328},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/KimKKBJKKLP13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KiyoyamaSHLFTK13,
author = {Kouji Kiyoyama and
Y. Sato and
Hiroyuki Hashimoto and
Kang Wook Lee and
Takafumi Fukushima and
Tetsu Tanaka and
Mitsumasa Koyanagi},
title = {A block-parallel {ADC} with digital noise cancelling for 3-D stacked
{CMOS} image sensor},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--4},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702363},
doi = {10.1109/3DIC.2013.6702363},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/KiyoyamaSHLFTK13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KoharaHSMYMO13,
author = {Sayuri Kohara and
Akihiro Horibe and
Kuniaki Sueoka and
Keiji Matsumoto and
Fumiaki Yamada and
Hiroyuki Mori and
Yasumitsu Orii},
title = {Thermo-mechanical evaluation of 3D packages},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--4},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702366},
doi = {10.1109/3DIC.2013.6702366},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/KoharaHSMYMO13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LamyCSLCL13,
author = {Yann Lamy and
Jean{-}Philippe Colonna and
G. Simon and
Patrick Leduc and
S{\'{e}}verine Cheramy and
C. Laviron},
title = {Which interconnects for which 3D applications? Status and perspectives},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--6},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702344},
doi = {10.1109/3DIC.2013.6702344},
timestamp = {Wed, 31 May 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/LamyCSLCL13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LamyDBFSDV13,
author = {Y. Lamy and
Laurent Dussopt and
Ossama El Bouayadi and
C. Ferrandon and
Alexandre Siligaris and
Cedric Dehos and
Pierre Vincent},
title = {A compact 3D silicon interposer package with integrated antenna for
60GHz wireless applications},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--6},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702345},
doi = {10.1109/3DIC.2013.6702345},
timestamp = {Thu, 05 Nov 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/LamyDBFSDV13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LeeKSLH13,
author = {Jae Hak Lee and
Hyoung Joon Kim and
Jun{-}Yeob Song and
Chang Woo Lee and
Tae Ho Ha},
title = {A study on wafer level {TSV} build-up integration method},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--4},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702355},
doi = {10.1109/3DIC.2013.6702355},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/LeeKSLH13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LeeTMNBFTK13,
author = {Kang Wook Lee and
Seiya Tanikawa and
Mariappan Murugesan and
H. Naganuma and
Jichoel Bea and
Takafumi Fukushima and
Tetsu Tanaka and
Mitsumasa Koyanagi},
title = {Impact of 3-D integration process on memory retention characteristics
in thinned {DRAM} chip for 3-D memory},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--4},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702336},
doi = {10.1109/3DIC.2013.6702336},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/LeeTMNBFTK13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LimKP13,
author = {Hong{-}Yeol Lim and
Min{-}Kwan Kee and
Gi{-}Ho Park},
title = {Phase detection based data prefetching for utilizing memory bandwidth
of 3D integrated circuits},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--5},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702357},
doi = {10.1109/3DIC.2013.6702357},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/LimKP13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LuLPJ13,
author = {Julia Hsin{-}Lin Lu and
Wing{-}Fai Loke and
Dimitrios Peroulis and
Byunghoo Jung},
title = {Implementing wireless communication links in 3-D ICs utilizing wide-band
on-chip meandering microbump antenna},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--5},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702334},
doi = {10.1109/3DIC.2013.6702334},
timestamp = {Fri, 19 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/LuLPJ13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LuS13,
author = {Tiantao Lu and
Ankur Srivastava},
title = {Detailed electrical and reliability study of tapered TSVs},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--7},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702350},
doi = {10.1109/3DIC.2013.6702350},
timestamp = {Thu, 18 Nov 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/LuS13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LueckGMHLT13,
author = {Matthew Lueck and
Chris W. Gregory and
Dean Malta and
Alan Huffman and
John M. Lannon and
Dorota Temple},
title = {High density interconnect bonding of heterogeneous materials using
non-collapsible microbumps at 10 {\(\mu\)}m pitch},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--5},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702387},
doi = {10.1109/3DIC.2013.6702387},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/LueckGMHLT13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MadhourZSBLTM13,
author = {Yassir Madhour and
Michael Zervas and
Gerd Schlottig and
Thomas Brunschwiler and
Yusuf Leblebici and
John Richard Thome and
Bruno Michel},
title = {Integration of intra chip stack fluidic cooling using thin-layer solder
bonding},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--8},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702343},
doi = {10.1109/3DIC.2013.6702343},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/MadhourZSBLTM13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MatsumotoISSKMOYFTK13,
author = {Keiji Matsumoto and
Soichiro Ibaraki and
Kuniaki Sueoka and
Katsuyuki Sakuma and
Hidekazu Kikuchi and
Hiroyuki Mori and
Yasumitsu Orii and
Fumiaki Yamada and
Kohei Fujihara and
Junichi Takamatsu and
Koji Kondo},
title = {Thermal design guideline and new cooling solution for a three-dimensional
{(3D)} chip stack},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--8},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702329},
doi = {10.1109/3DIC.2013.6702329},
timestamp = {Sat, 19 Oct 2019 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/MatsumotoISSKMOYFTK13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MauerTLYO13,
author = {Laura B. Mauer and
John Taddei and
Elena Lawrence and
Ramey Youssef and
Stephen P. Olson},
title = {Silicon Etch with integrated metrology for through silicon via {(TSV)}
reveal},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--4},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702325},
doi = {10.1109/3DIC.2013.6702325},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/MauerTLYO13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MoriOWISIOMKHTK13,
author = {Kentaro Mori and
Yoshihiro Ono and
Shinji Watanabe and
Toshikazu Ishikawa and
Michiaki Sugiyama and
Satoshi Imasu and
Toshihiko Ochiai and
Ryo Mori and
Tsuyoshi Kida and
Tomoaki Hashimoto and
Hideki Tanaka and
Michitaka Kimura},
title = {High density and reliable packaging technology with Non Conductive
Film for 3D/TSV},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--7},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702322},
doi = {10.1109/3DIC.2013.6702322},
timestamp = {Wed, 01 Jul 2020 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/MoriOWISIOMKHTK13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MurugesanBLFTKSWK13,
author = {Mariappan Murugesan and
Jichoel Bea and
Kang Wook Lee and
Takafumi Fukushima and
Tetsu Tanaka and
Mitsumasa Koyanagi and
Yuji Sutou and
H. Wang and
J. Koike},
title = {Effect of {CVD} Mn oxide layer as Cu diffusion barrier for {TSV}},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--4},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702364},
doi = {10.1109/3DIC.2013.6702364},
timestamp = {Tue, 16 Feb 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/MurugesanBLFTKSWK13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/NakamuraMKKMKSHKAUO13,
author = {Tadao Nakamura and
Yoriko Mizushima and
Hideki Kitada and
Young{-}Suk Kim and
Nobuhide Maeda and
Shoichi Kodama and
Ryuichi Sugie and
Hiroshi Hashimoto and
Akihito Kawai and
Kazuhisa Arai and
Akira Uedono and
Takayuki Ohba},
title = {Influence of wafer thinning process on backside damage in 3D integration},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--6},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702400},
doi = {10.1109/3DIC.2013.6702400},
timestamp = {Sun, 25 Oct 2020 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/NakamuraMKKMKSHKAUO13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/NishizawaASSI13,
author = {S. Nishizawa and
Ryohei Arima and
Tomohiro Shimizu and
Shoso Shingubara and
Fumihiro Inoue},
title = {Highly conformal and adhesive electroless barrier and Cu seed formation
using nanoparticle catalyst for realizing a high aspect ratio cu-filled
{TSV}},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--4},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702392},
doi = {10.1109/3DIC.2013.6702392},
timestamp = {Sun, 25 Oct 2020 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/NishizawaASSI13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/NukagaSYS13,
author = {Osamu Nukaga and
Tatsuya Shioiri and
Satoshi Yamamoto and
Tatsuo Suemasu},
title = {Glass interposer with high-density three-dimensional structured {TGV}
for 3D system integration},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--4},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702321},
doi = {10.1109/3DIC.2013.6702321},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/NukagaSYS13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/Or-Bach13,
author = {Zvi Or{-}Bach},
title = {The monolithic 3D advantage: Monolithic 3D is far more than just an
alternative to 0.7x scaling},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--7},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702316},
doi = {10.1109/3DIC.2013.6702316},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/Or-Bach13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/PanCH13,
author = {Stephen H. Pan and
Norman Chang and
Tadaaki Hitomi},
title = {3D-IC dynamic thermal analysis with hierarchical and configurable
chip thermal model},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--8},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702373},
doi = {10.1109/3DIC.2013.6702373},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/PanCH13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/PangraciousMM13,
author = {Vinod Pangracious and
Habib Mehrez and
Zied Marrakchi},
title = {Designing a 3D tree-based {FPGA:} Optimization of butterfly programmable
interconnect topology using 3D technology},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--8},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702342},
doi = {10.1109/3DIC.2013.6702342},
timestamp = {Thu, 15 Jun 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/PangraciousMM13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/PanthSL13,
author = {Shreepad Panth and
Kambiz Samadi and
Sung Kyu Lim},
title = {Test-TSV estimation during 3D-IC partitioning},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--7},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702354},
doi = {10.1109/3DIC.2013.6702354},
timestamp = {Sun, 02 Oct 2022 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/PanthSL13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/PradhanGRD13,
author = {Manjari Pradhan and
Chandan Giri and
Hafizur Rahaman and
Debesh K. Das},
title = {Optimal stacking of SOCs in a 3D-SIC for post-bond testing},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--5},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702393},
doi = {10.1109/3DIC.2013.6702393},
timestamp = {Tue, 07 May 2024 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/PradhanGRD13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/PuschmannBBWFJMZGOWLZ13,
author = {Rene Puschmann and
Mathias Bottcher and
Irene Bartusseck and
Frank Windrich and
Conny Fiedler and
Peggy John and
Charles Alix Manier and
Kai Zoschke and
Jurgen Grafe and
Hermann Oppermann and
J{\"{u}}rgen Wolf and
K. Dieter Lang and
Michael Ziesmann},
title = {3D integration of standard integrated circuits},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--7},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702314},
doi = {10.1109/3DIC.2013.6702314},
timestamp = {Sat, 30 Sep 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/PuschmannBBWFJMZGOWLZ13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/QuinnL13,
author = {James Quinn and
Barbara Loferer},
title = {Quality in 3D assembly - Is "Known Good Die" good enough?},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--5},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702323},
doi = {10.1109/3DIC.2013.6702323},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/QuinnL13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/QuiringOB13,
author = {Artur Quiring and
Markus Olbrich and
Erich Barke},
title = {Improving 3D-Floorplanning using smart selection operations in meta-heuristic
optimization},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--6},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702337},
doi = {10.1109/3DIC.2013.6702337},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/QuiringOB13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/RajendranHCO13,
author = {Bipin Rajendran and
Albert K. Henning and
Brian Cronquist and
Zvi Or{-}Bach},
title = {Pulsed laser annealing: {A} scalable and practical technology for
monolithic 3D {IC}},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--5},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702386},
doi = {10.1109/3DIC.2013.6702386},
timestamp = {Mon, 29 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/RajendranHCO13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/RawatGS13,
author = {Indira Rawat and
M. K. Gupta and
Virendra Singh},
title = {Thermal analysis and modeling of 3D integrated circuits for test scheduling},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--5},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702374},
doi = {10.1109/3DIC.2013.6702374},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/RawatGS13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/ReMTGMR13,
author = {Valerio Re and
Massimo Manghisoni and
Gianluca Traversi and
Luigi Gaioni and
Alessia Manazza and
Lodovico Ratti},
title = {Active pixel sensors with enhanced pixel-level analog and digital
functionalities in a 2-tier 3D {CMOS} technology},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--7},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702333},
doi = {10.1109/3DIC.2013.6702333},
timestamp = {Sun, 02 Jun 2019 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/ReMTGMR13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/RoyCGR13,
author = {Surajit Kumar Roy and
Sobitri Chatterjee and
Chandan Giri and
Hafizur Rahaman},
title = {Faulty TSVs identification and recovery in 3D stacked ICs during pre-bond
testing},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--6},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702339},
doi = {10.1109/3DIC.2013.6702339},
timestamp = {Tue, 22 Oct 2019 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/RoyCGR13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/SantosVDGPR13,
author = {Cristiano Santos and
Pascal Vivet and
Denis Dutoit and
Philippe Garrault and
Nicolas Peltier and
Ricardo Reis},
title = {System-level thermal modeling for 3D circuits: Characterization with
a 65nm memory-on-logic circuit},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--6},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702379},
doi = {10.1109/3DIC.2013.6702379},
timestamp = {Tue, 07 May 2024 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/SantosVDGPR13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/SerafySSY13,
author = {Caleb Serafy and
Bing Shi and
Ankur Srivastava and
Donald Yeung},
title = {High performance 3D stacked {DRAM} processor architectures with micro-fluidic
cooling},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--8},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702353},
doi = {10.1109/3DIC.2013.6702353},
timestamp = {Thu, 18 Nov 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/SerafySSY13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/SongLKLH13,
author = {Jun{-}Yeob Song and
Jae Hak Lee and
Hyoung Joon Kim and
Chang Woo Lee and
Tae Ho Ha},
title = {High reliability insert-bump bonding process for 3D integration},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--4},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702356},
doi = {10.1109/3DIC.2013.6702356},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/SongLKLH13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/SouareCFJFGBCCGLCTM13,
author = {Papa Momar Souare and
Fran{\c{c}}ois de Crecy and
Vincent Fiori and
M. Haykel Ben Jamaa and
Alexis Farcy and
S{\'{e}}bastien Gallois{-}Garreignot and
Andras Borbely and
Jean{-}Philippe Colonna and
Perceval Coudrain and
B. Giraud and
C. Laviron and
S{\'{e}}verine Cheramy and
Cl{\'{e}}ment Tavernier and
Jean Michailos},
title = {Thermal correlation between measurements and {FEM} simulations in
3D ICs},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--6},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702362},
doi = {10.1109/3DIC.2013.6702362},
timestamp = {Thu, 21 Jan 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/SouareCFJFGBCCGLCTM13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/SuhF13,
author = {Edward J. Suh and
Paul D. Franzon},
title = {Design of 60 GHz contactless probe system for {RDL} in passive silicon
interposer},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--5},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702352},
doi = {10.1109/3DIC.2013.6702352},
timestamp = {Sat, 19 Oct 2019 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/SuhF13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/SylvesterHJE13,
author = {Yuri Sylvester and
Luke Hunter and
Bruce Johnson and
Raleigh Estrada},
title = {3D X-ray microscopy: {A} near-SEM non-destructive imaging technology
used in the development of 3D {IC} packaging},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--7},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702396},
doi = {10.1109/3DIC.2013.6702396},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/SylvesterHJE13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/TadaEK13,
author = {Jubee Tada and
Ryusuke Egawa and
Hiroaki Kobayashi},
title = {Design of a 3-D stacked floating-point adder},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--4},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702390},
doi = {10.1109/3DIC.2013.6702390},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/TadaEK13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/TakayaNI13,
author = {Satoshi Takaya and
Makoto Nagata and
Hiroaki Ikeda},
title = {Very low-voltage swing while high-bandwidth data transmission through
4096 bit TSVs},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--4},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702359},
doi = {10.1109/3DIC.2013.6702359},
timestamp = {Thu, 14 Oct 2021 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/TakayaNI13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/TaouilHMB13,
author = {Mottaqiallah Taouil and
Said Hamdioui and
Erik Jan Marinissen and
Sudipta Bhawmik},
title = {Using 3D-COSTAR for 2.5D test cost optimization},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--8},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702351},
doi = {10.1109/3DIC.2013.6702351},
timestamp = {Mon, 05 Feb 2024 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/TaouilHMB13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/TshibanguFRD13,
author = {Nyunyi M. Tshibangu and
Paul D. Franzon and
Eric Rotenberg and
William Rhett Davis},
title = {Design of controller for {L2} cache mapped in Tezzaron stacked {DRAM}},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--4},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702397},
doi = {10.1109/3DIC.2013.6702397},
timestamp = {Thu, 14 Oct 2021 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/TshibanguFRD13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/UhrmannMWBBWL13,
author = {Thomas Uhrmann and
Thorsten Matthias and
Markus Wimplinger and
Jurgen Burggraf and
Daniel Burgstaller and
Harald Wiesbauer and
Paul Lindner},
title = {Recent progress in thin wafer processing},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--8},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702341},
doi = {10.1109/3DIC.2013.6702341},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/UhrmannMWBBWL13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/VelenisDMB13,
author = {Dimitrios Velenis and
Mikael Detalle and
Erik Jan Marinissen and
Eric Beyne},
title = {Si interposer build-up options and impact on 3D system cost},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--5},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702367},
doi = {10.1109/3DIC.2013.6702367},
timestamp = {Mon, 05 Feb 2024 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/VelenisDMB13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/VianneBFPCGFCEHT13,
author = {Benjamin Vianne and
Pierre Bar and
Vincent Fiori and
Sebastien Petitdidier and
Norbert Chevrier and
S{\'{e}}bastien Gallois{-}Garreignot and
Alexis Farcy and
Pascal Chausse and
Stephanie Escoubas and
Nicolas Hotellier and
Olivier Thomas},
title = {Thermo-mechanical study of a 2.5D passive silicon interposer technology:
Experimental, numerical and In-Situ stress sensors developments},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--7},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702332},
doi = {10.1109/3DIC.2013.6702332},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/VianneBFPCGFCEHT13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/WahbyDB13,
author = {William Wahby and
Ashish Dembla and
Muhannad S. Bakir},
title = {Evaluation of 3DICs and fabrication of monolithic interlayer vias},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--6},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702378},
doi = {10.1109/3DIC.2013.6702378},
timestamp = {Fri, 14 Jul 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/WahbyDB13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/WangMDYWY13,
author = {Jiacheng Wang and
Shunli Ma and
Sai Manoj Pudukotai Dinakarrao and
Mingbin Yu and
Roshan Weerasekera and
Hao Yu},
title = {High-speed and low-power 2.5D {I/O} circuits for memory-logic-integration
by through-silicon interposer},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--4},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702326},
doi = {10.1109/3DIC.2013.6702326},
timestamp = {Sat, 30 Sep 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/WangMDYWY13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/WeldezionGPJT13,
author = {Awet Yemane Weldezion and
Matt Grange and
Dinesh Pamunuwa and
Axel Jantsch and
Hannu Tenhunen},
title = {A scalable multi-dimensional NoC simulation model for diverse spatio-temporal
traffic patterns},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--5},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702365},
doi = {10.1109/3DIC.2013.6702365},
timestamp = {Tue, 21 Mar 2023 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/WeldezionGPJT13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/WindrichS13,
author = {Frank Windrich and
Andreas Schenke},
title = {Front to backside alignment for {TSV} based 3D integration},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--6},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702371},
doi = {10.1109/3DIC.2013.6702371},
timestamp = {Thu, 15 Jun 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/WindrichS13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/YagliogluE13,
author = {Onnik Yaglioglu and
Ben Eldridge},
title = {Contact testing of copper micro-pillars with very low damage for 3D
{IC} assembly},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--4},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702361},
doi = {10.1109/3DIC.2013.6702361},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/YagliogluE13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/YavitsMG13,
author = {Leonid Yavits and
Amir Morad and
Ran Ginosar},
title = {3D cache hierarchy optimization},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--5},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702346},
doi = {10.1109/3DIC.2013.6702346},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/YavitsMG13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/YiZ13,
author = {Yang Yi and
Yaping Zhou},
title = {A novel circuit model for multiple Through Silicon Vias (TSVs) in
3D {IC}},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--4},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702389},
doi = {10.1109/3DIC.2013.6702389},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/YiZ13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/ZhangF13,
author = {Zhenqian Zhang and
Paul D. Franzon},
title = {TSV-based, modular and collision detectable face-to-back shared bus
design},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--5},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702399},
doi = {10.1109/3DIC.2013.6702399},
timestamp = {Sat, 19 Oct 2019 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/ZhangF13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/ZhangLA13,
author = {Bei Zhang and
Baohu Li and
Vishwani D. Agrawal},
title = {Yield analysis of a novel wafer manipulation method in 3D stacking},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--8},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702370},
doi = {10.1109/3DIC.2013.6702370},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/ZhangLA13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/ZhangNCF13,
author = {Zhenqian Zhang and
Brandon Noia and
Krishnendu Chakrabarty and
Paul D. Franzon},
title = {Face-to-face bus design with built-in self-test in 3D ICs},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--7},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702395},
doi = {10.1109/3DIC.2013.6702395},
timestamp = {Mon, 03 Jan 2022 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/3dic/ZhangNCF13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/ZhangOB13,
author = {Yue Zhang and
Hanju Oh and
Muhannad S. Bakir},
title = {Within-tier cooling and thermal isolation technologies for heterogeneous
3D ICs},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--6},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702398},
doi = {10.1109/3DIC.2013.6702398},
timestamp = {Sun, 21 May 2017 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/ZhangOB13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/ZhangZDLTXT13,
author = {Jiye Zhang and
Lin Zhang and
Yuanwei Dong and
Hongyu Li and
Cher Ming Tan and
Guangrui Xia and
Chuan Seng Tan},
title = {The dependency of {TSV} keep-out zone {(KOZ)} on Si crystal direction
and liner material},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--5},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702368},
doi = {10.1109/3DIC.2013.6702368},
timestamp = {Wed, 22 Jun 2022 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/ZhangZDLTXT13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/ZhuASSHPF13,
author = {Qiuling Zhu and
Berkin Akin and
Huseyin Ekin Sumbul and
Fazle Sadi and
James C. Hoe and
Larry T. Pileggi and
Franz Franchetti},
title = {A 3D-stacked logic-in-memory accelerator for application-specific
data intensive computing},
booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
pages = {1--7},
publisher = {{IEEE}},
year = {2013},
url = {https://doi.org/10.1109/3DIC.2013.6702348},
doi = {10.1109/3DIC.2013.6702348},
timestamp = {Mon, 01 Apr 2024 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/ZhuASSHPF13.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@proceedings{DBLP:conf/3dic/2013,
title = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
San Francisco, CA, USA, October 2-4, 2013},
publisher = {{IEEE}},
year = {2013},
url = {https://ieeexplore.ieee.org/xpl/conhome/6690582/proceeding},
isbn = {978-1-4673-6484-3},
timestamp = {Wed, 16 Oct 2019 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/3dic/2013.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
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