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@inproceedings{DBLP:conf/techdebt/0003ACMKB23,
  author       = {Nikolaos Nikolaidis and
                  Apostolos Ampatzoglou and
                  Alexander Chatzigeorgiou and
                  Nikolaos Mittas and
                  Evdokimos I. Konstantinidis and
                  Panagiotis D. Bamidis},
  title        = {Exploring the Effect of Various Maintenance Activities on the Accumulation
                  of {TD} Principal},
  booktitle    = {2023 {ACM/IEEE} International Conference on Technical Debt (TechDebt),
                  Melbourne, Australia, May 14-15, 2023},
  pages        = {102--111},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/TechDebt59074.2023.00018},
  doi          = {10.1109/TECHDEBT59074.2023.00018},
  timestamp    = {Tue, 30 Jan 2024 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/techdebt/0003ACMKB23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/techdebt/AikenMBJSV23,
  author       = {William Aiken and
                  Paul K. Mvula and
                  Paula Branco and
                  Guy{-}Vincent Jourdan and
                  Mehrdad Sabetzadeh and
                  Herna L. Viktor},
  title        = {Measuring Improvement of F1-Scores in Detection of Self-Admitted Technical
                  Debt},
  booktitle    = {2023 {ACM/IEEE} International Conference on Technical Debt (TechDebt),
                  Melbourne, Australia, May 14-15, 2023},
  pages        = {37--41},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/TechDebt59074.2023.00011},
  doi          = {10.1109/TECHDEBT59074.2023.00011},
  timestamp    = {Mon, 29 Jan 2024 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/techdebt/AikenMBJSV23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/techdebt/BiVDHC23,
  author       = {Fandi Bi and
                  Birgit Vogel{-}Heuser and
                  Fengmin Du and
                  Nils Hanich and
                  Ennuri Cho},
  title        = {Technical Debt Contagiousness Metrics for Measurement and Prioritization
                  in Mechatronics},
  booktitle    = {2023 {ACM/IEEE} International Conference on Technical Debt (TechDebt),
                  Melbourne, Australia, May 14-15, 2023},
  pages        = {42--51},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/TechDebt59074.2023.00012},
  doi          = {10.1109/TECHDEBT59074.2023.00012},
  timestamp    = {Mon, 29 Jan 2024 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/techdebt/BiVDHC23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/techdebt/FinkeNR23,
  author       = {Markus Finke and
                  Thomas Neff and
                  Tobias Reichl},
  title        = {How to introduce {TD} Management into a Software Development Process
                  - {A} Practical Approach},
  booktitle    = {2023 {ACM/IEEE} International Conference on Technical Debt (TechDebt),
                  Melbourne, Australia, May 14-15, 2023},
  pages        = {52--61},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/TechDebt59074.2023.00013},
  doi          = {10.1109/TECHDEBT59074.2023.00013},
  timestamp    = {Mon, 29 Jan 2024 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/techdebt/FinkeNR23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/techdebt/GigantePBJL0B23,
  author       = {Domenico Gigante and
                  Fabiano Pecorelli and
                  Vita Santa Barletta and
                  Andrea Janes and
                  Valentina Lenarduzzi and
                  Davide Taibi and
                  Maria Teresa Baldassarre},
  title        = {Resolving Security Issues via Quality-Oriented Refactoring: {A} User
                  Study},
  booktitle    = {2023 {ACM/IEEE} International Conference on Technical Debt (TechDebt),
                  Melbourne, Australia, May 14-15, 2023},
  pages        = {82--91},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/TechDebt59074.2023.00016},
  doi          = {10.1109/TECHDEBT59074.2023.00016},
  timestamp    = {Mon, 05 Feb 2024 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/techdebt/GigantePBJL0B23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/techdebt/Graf-Vlachy023,
  author       = {Lorenz Graf{-}Vlachy and
                  Stefan Wagner},
  title        = {The Type to Take Out a Loan? {A} Study of Developer Personality and
                  Technical Debt},
  booktitle    = {2023 {ACM/IEEE} International Conference on Technical Debt (TechDebt),
                  Melbourne, Australia, May 14-15, 2023},
  pages        = {27--36},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/TechDebt59074.2023.00010},
  doi          = {10.1109/TECHDEBT59074.2023.00010},
  timestamp    = {Tue, 07 May 2024 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/techdebt/Graf-Vlachy023.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/techdebt/JinZSH0L23,
  author       = {Wuxia Jin and
                  Yuyun Zhang and
                  Jiaowei Shang and
                  Yi Hou and
                  Ming Fan and
                  Ting Liu},
  title        = {Identifying Code Changes for Architecture Decay via a Metric Forest
                  Structure},
  booktitle    = {2023 {ACM/IEEE} International Conference on Technical Debt (TechDebt),
                  Melbourne, Australia, May 14-15, 2023},
  pages        = {62--71},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/TechDebt59074.2023.00014},
  doi          = {10.1109/TECHDEBT59074.2023.00014},
  timestamp    = {Mon, 29 Jan 2024 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/techdebt/JinZSH0L23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/techdebt/LiSA23,
  author       = {Yikun Li and
                  Mohamed Soliman and
                  Paris Avgeriou},
  title        = {Automatically Identifying Relations Between Self-Admitted Technical
                  Debt Across Different Sources},
  booktitle    = {2023 {ACM/IEEE} International Conference on Technical Debt (TechDebt),
                  Melbourne, Australia, May 14-15, 2023},
  pages        = {11--21},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/TechDebt59074.2023.00008},
  doi          = {10.1109/TECHDEBT59074.2023.00008},
  timestamp    = {Tue, 07 May 2024 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/techdebt/LiSA23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/techdebt/Sheikhaei023,
  author       = {Mohammad Sadegh Sheikhaei and
                  Yuan Tian},
  title        = {Automated Self-Admitted Technical Debt Tracking at Commit-Level: {A}
                  Language-independent Approach},
  booktitle    = {2023 {ACM/IEEE} International Conference on Technical Debt (TechDebt),
                  Melbourne, Australia, May 14-15, 2023},
  pages        = {22--26},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/TechDebt59074.2023.00009},
  doi          = {10.1109/TECHDEBT59074.2023.00009},
  timestamp    = {Mon, 29 Jan 2024 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/techdebt/Sheikhaei023.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/techdebt/SilvaUW23,
  author       = {Lakmal Silva and
                  Michael Unterkalmsteiner and
                  Krzysztof Wnuk},
  title        = {Towards identifying and minimizing customer-facing documentation debt},
  booktitle    = {2023 {ACM/IEEE} International Conference on Technical Debt (TechDebt),
                  Melbourne, Australia, May 14-15, 2023},
  pages        = {72--81},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/TechDebt59074.2023.00015},
  doi          = {10.1109/TECHDEBT59074.2023.00015},
  timestamp    = {Mon, 05 Feb 2024 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/techdebt/SilvaUW23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/techdebt/SkrysethSPM23,
  author       = {Daniel Skryseth and
                  Karthik Shivashankar and
                  Ildik{\'{o}} Pil{\'{a}}n and
                  Antonio Martini},
  title        = {Technical Debt Classification in Issue Trackers using Natural Language
                  Processing based on Transformers},
  booktitle    = {2023 {ACM/IEEE} International Conference on Technical Debt (TechDebt),
                  Melbourne, Australia, May 14-15, 2023},
  pages        = {92--101},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/TechDebt59074.2023.00017},
  doi          = {10.1109/TECHDEBT59074.2023.00017},
  timestamp    = {Mon, 29 Jan 2024 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/techdebt/SkrysethSPM23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/techdebt/WilderMWKP23,
  author       = {Gregory Wilder II and
                  Riley Miyamoto and
                  Samuel Watson and
                  Rick Kazman and
                  Anthony Peruma},
  title        = {An Exploratory Study on the Occurrence of Self-Admitted Technical
                  Debt in Android Apps},
  booktitle    = {2023 {ACM/IEEE} International Conference on Technical Debt (TechDebt),
                  Melbourne, Australia, May 14-15, 2023},
  pages        = {1--10},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/TechDebt59074.2023.00007},
  doi          = {10.1109/TECHDEBT59074.2023.00007},
  timestamp    = {Mon, 29 Jan 2024 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/techdebt/WilderMWKP23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@proceedings{DBLP:conf/techdebt/2023,
  title        = {2023 {ACM/IEEE} International Conference on Technical Debt (TechDebt),
                  Melbourne, Australia, May 14-15, 2023},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/TechDebt59074.2023},
  doi          = {10.1109/TECHDEBT59074.2023},
  isbn         = {979-8-3503-1194-5},
  timestamp    = {Mon, 29 Jan 2024 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/techdebt/2023.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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