Search dblp for Publications

export results for "toc:db/conf/3dic/3dic2023.bht:"

 download as .bib file

@inproceedings{DBLP:conf/3dic/ChuangLCBWGM23,
  author       = {Po{-}Yao Chuang and
                  Francesco Lorenzelli and
                  Sreejit Chakravarty and
                  Slimane Boutobza and
                  Cheng{-}Wen Wu and
                  Georges G. E. Gielen and
                  Erik Jan Marinissen},
  title        = {Effective and Efficient Test and Diagnosis Pattern Generation for
                  Many Inter-Die Interconnects in Chiplet-Based Packages},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2023,
                  Cork, Ireland, May 10-12, 2023},
  pages        = {1--6},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/3DIC57175.2023.10154900},
  doi          = {10.1109/3DIC57175.2023.10154900},
  timestamp    = {Sat, 30 Sep 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/ChuangLCBWGM23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/DurmazHCLKW23,
  author       = {Emre Can Durmaz and
                  Carl Heine and
                  Zhibo Cao and
                  Jens Lehmann and
                  Dietmar Kissinger and
                  Matthias Wietstruck},
  title        = {SiGe BiCMOS Technology with Embedded Microchannels based on Cu Pillar
                  {PCB} Integration Enabling sub-THz Microfluidic Sensor Applications},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2023,
                  Cork, Ireland, May 10-12, 2023},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/3DIC57175.2023.10155073},
  doi          = {10.1109/3DIC57175.2023.10155073},
  timestamp    = {Mon, 10 Jul 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/DurmazHCLKW23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/Hachiya23,
  author       = {Koutaro Hachiya},
  title        = {Measurement Point Selection Algorithms for Testing Power TSVs},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2023,
                  Cork, Ireland, May 10-12, 2023},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/3DIC57175.2023.10154929},
  doi          = {10.1109/3DIC57175.2023.10154929},
  timestamp    = {Mon, 10 Jul 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/Hachiya23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/HossamF23,
  author       = {Nermeen Hossam and
                  John Ferguson},
  title        = {Fast, Accurate Assembly-Level Physical Verification of 3DIC Packages},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2023,
                  Cork, Ireland, May 10-12, 2023},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/3DIC57175.2023.10155000},
  doi          = {10.1109/3DIC57175.2023.10155000},
  timestamp    = {Mon, 10 Jul 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/HossamF23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/KashyapRWBWWF23,
  author       = {Priyank Kashyap and
                  Prasanth Prabu Ravichandiran and
                  Lee Wang and
                  Dror Baron and
                  Chau{-}Wai Wong and
                  Tianfu Wu and
                  Paul D. Franzon},
  title        = {Thermal Estimation for 3D-ICs Through Generative Networks},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2023,
                  Cork, Ireland, May 10-12, 2023},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/3DIC57175.2023.10154977},
  doi          = {10.1109/3DIC57175.2023.10154977},
  timestamp    = {Sat, 30 Sep 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/KashyapRWBWWF23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/MasselinkSYH23,
  author       = {Erik W. Masselink and
                  Andrew Stark and
                  Benjamin B. Yang and
                  T. Robert Harris},
  title        = {Review of Hybrid Integration Techniques for Integrating {III-V} Onta
                  Silicon},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2023,
                  Cork, Ireland, May 10-12, 2023},
  pages        = {1--7},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/3DIC57175.2023.10154923},
  doi          = {10.1109/3DIC57175.2023.10154923},
  timestamp    = {Mon, 10 Jul 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/MasselinkSYH23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/MurugesanSSMKF23,
  author       = {Mariappan Murugesan and
                  M. Sawa and
                  E. Sone and
                  Makoto Motoyoshi and
                  Mitsumasa Koyanagi and
                  Takafumi Fukushima},
  title        = {Copper Electrode Surface Features and Cu-SiO2Hybrid Bonding},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2023,
                  Cork, Ireland, May 10-12, 2023},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/3DIC57175.2023.10154924},
  doi          = {10.1109/3DIC57175.2023.10154924},
  timestamp    = {Mon, 10 Jul 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/MurugesanSSMKF23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/NaeimYCBDSBCPBM23,
  author       = {Mohamed Naeim and
                  Hanqi Yang and
                  Pinhong Chen and
                  Rong Bao and
                  Antoine Dekeyser and
                  Giuliano Sisto and
                  Moritz Brunion and
                  Rongmei Chen and
                  Geert Van der Plas and
                  Eric Beyne and
                  Dragomir Milojevic},
  title        = {Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding
                  and TSVs},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2023,
                  Cork, Ireland, May 10-12, 2023},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/3DIC57175.2023.10155075},
  doi          = {10.1109/3DIC57175.2023.10155075},
  timestamp    = {Sat, 30 Sep 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/NaeimYCBDSBCPBM23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/PalYOAOCSK23,
  author       = {Somnath Pal and
                  Liang Ye and
                  James O'Callaghan and
                  Fatih Bilge Atar and
                  Cian O'Mathuna and
                  Brian Corbett and
                  Ranajit Sai and
                  Sambuddha Khan},
  title        = {A Study on a Tether-Less Approach Towards Micro-Transfer-Printing
                  of Large-Footprint Power Micro-Inductor Chiplets},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2023,
                  Cork, Ireland, May 10-12, 2023},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/3DIC57175.2023.10155034},
  doi          = {10.1109/3DIC57175.2023.10155034},
  timestamp    = {Sat, 30 Sep 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/PalYOAOCSK23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/ShenLHSKTMKF23,
  author       = {Jiayi Shen and
                  Chang Liu and
                  Tadaaki Hoshi and
                  Atsushi Sinoda and
                  Hisashi Kino and
                  Tetsu Tanaka and
                  Mariappan Murugesan and
                  Mitsumasa Koyanagi and
                  Takafumi Fukushima},
  title        = {Impact of Super-long-throw {PVD} on {TSV} Metallization and Die-to-Wafer
                  3D Integration Based on Via-last},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2023,
                  Cork, Ireland, May 10-12, 2023},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/3DIC57175.2023.10154930},
  doi          = {10.1109/3DIC57175.2023.10154930},
  timestamp    = {Mon, 10 Jul 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/ShenLHSKTMKF23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/StevensPRF23,
  author       = {Joshua A. Stevens and
                  Tse{-}Han Pan and
                  Prasanth Prabu Ravichandiran and
                  Paul D. Franzon},
  title        = {Chiplet Set For Artificial Intelligence},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2023,
                  Cork, Ireland, May 10-12, 2023},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/3DIC57175.2023.10154953},
  doi          = {10.1109/3DIC57175.2023.10154953},
  timestamp    = {Sat, 30 Sep 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/StevensPRF23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/ZaghariSRFH23,
  author       = {Pouria Zaghari and
                  Sourish S. Sinha and
                  Jong Eun Ryu and
                  Paul D. Franzon and
                  Douglas C. Hopkins},
  title        = {Thermal Cycling and Fatigue Life Analysis of a Laterally Conducting
                  GaN-based Power Package},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2023,
                  Cork, Ireland, May 10-12, 2023},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/3DIC57175.2023.10154901},
  doi          = {10.1109/3DIC57175.2023.10154901},
  timestamp    = {Sat, 30 Sep 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/ZaghariSRFH23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@proceedings{DBLP:conf/3dic/2023,
  title        = {{IEEE} International 3D Systems Integration Conference, 3DIC 2023,
                  Cork, Ireland, May 10-12, 2023},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/3DIC57175.2023},
  doi          = {10.1109/3DIC57175.2023},
  isbn         = {979-8-3503-1137-2},
  timestamp    = {Mon, 10 Jul 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/2023.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
a service of  Schloss Dagstuhl - Leibniz Center for Informatics

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.