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"Maximizing the Functional Yield of Wafer-to-Wafer 3-D Integration."
Sherief Reda, Gregory Smith, Larry Smith (2009)
- Sherief Reda, Gregory Smith, Larry Smith:
Maximizing the Functional Yield of Wafer-to-Wafer 3-D Integration. IEEE Trans. Very Large Scale Integr. Syst. 17(9): 1357-1362 (2009)
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