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"Fast Scan-Chain Ordering for 3-D-IC Designs Under Through-Silicon-Via ..."

Christina C.-H. Liao et al. (2013)

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DOI: 10.1109/TVLSI.2012.2204781

access: closed

type: Journal Article

metadata version: 2022-06-23

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Christina C.-H. Liao, Allen W.-T. Chen, Louis Y.-Z. Lin, Charles H.-P. Wen:
Fast Scan-Chain Ordering for 3-D-IC Designs Under Through-Silicon-Via (TSV) Constraints. IEEE Trans. Very Large Scale Integr. Syst. 21(6): 1170-1174 (2013)

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