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"Fast Fixed-Outline 3-D IC Floorplanning With TSV Co-Placement."

Cha-Ru Li, Wai-Kei Mak, Ting-Chi Wang (2013)

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DOI: 10.1109/TVLSI.2012.2190537

access: closed

type: Journal Article

metadata version: 2020-03-11

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  - https://dblp.org/rec/journals/tvlsi/LiMW13
Cha-Ru Li, Wai-Kei Mak, Ting-Chi Wang:
Fast Fixed-Outline 3-D IC Floorplanning With TSV Co-Placement. IEEE Trans. Very Large Scale Integr. Syst. 21(3): 523-532 (2013)

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