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"Alleviating Through-Silicon-Via Electromigration for 3-D Integrated ..."

Yuanqing Cheng et al. (2016)

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DOI: 10.1109/TVLSI.2016.2543260

access: closed

type: Journal Article

metadata version: 2020-04-05

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  - https://dblp.org/rec/journals/tvlsi/ChengTYZ16
Yuanqing Cheng, Aida Todri-Sanial, Jianlei Yang, Weisheng Zhao:
Alleviating Through-Silicon-Via Electromigration for 3-D Integrated Circuits Taking Advantage of Self-Healing Effect. IEEE Trans. Very Large Scale Integr. Syst. 24(11): 3310-3322 (2016)

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