"Wafer-level package interconnect options."

J. Balachandran et al. (2006)

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DOI: 10.1109/TVLSI.2006.878229

access: closed

type: Journal Article

metadata version: 2023-09-30

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J. Balachandran, Steven Brebels, Geert Carchon, Maarten Kuijk, Walter De Raedt, Bart Nauwelaers, Eric Beyne:
Wafer-level package interconnect options. IEEE Trans. Very Large Scale Integr. Syst. 14(6): 654-659 (2006)

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