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"A Study on Effects of Copper Wrap Specifications on Printed Circuit Board ..."

Bhanu Sood et al. (2019)

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DOI: 10.1109/TR.2018.2835140

access: closed

type: Journal Article

metadata version: 2022-10-02

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Bhanu Sood, John Shue, Jesse Leitner, Kelly Daniluk, Lionel-Nobel Sindjui:
A Study on Effects of Copper Wrap Specifications on Printed Circuit Board Reliability. IEEE Trans. Reliab. 68(1): 248-266 (2019)

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