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"NDI of delamination in IC packages using millimeter-waves."

Yang Ju, Masumi Saka, Hiroyuki Abé (2001)

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DOI: 10.1109/19.948319

access: closed

type: Journal Article

metadata version: 2020-06-08

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Yang Ju, Masumi Saka, Hiroyuki Abé:
NDI of delamination in IC packages using millimeter-waves. IEEE Trans. Instrum. Meas. 50(4): 1019-1023 (2001)

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