"Integrated hardware and software for improved flatness measurement with ..."

Hai Ding et al. (2005)

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DOI: 10.1109/TIM.2005.855088

access: closed

type: Journal Article

metadata version: 2020-06-08

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Hai Ding, I. Charles Ume, Jian Zhang, Daniel F. Baldwin:
Integrated hardware and software for improved flatness measurement with ATC4.1 flip-chip assembly case study. IEEE Trans. Instrum. Meas. 54(5): 1898-1904 (2005)

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