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"Thermographic Data Analysis for Defect Detection by Imposing Spatial ..."

Ching-Mei Wen et al. (2021)

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DOI: 10.1109/TII.2020.3010273

access: closed

type: Journal Article

metadata version: 2021-03-23

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  - https://dblp.org/rec/journals/tii/WenSG021
Ching-Mei Wen, Stefano Sfarra, Gianfranco Gargiulo, Yuan Yao:
Thermographic Data Analysis for Defect Detection by Imposing Spatial Connectivity and Sparsity Constraints in Principal Component Thermography. IEEE Trans. Ind. Informatics 17(6): 3901-3909 (2021)

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