"Study on Dipping Mathematical Models for the Solder Flip-Chip Bonding in ..."

Junhui Li et al. (2018)

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DOI: 10.1109/TII.2018.2805297

access: closed

type: Journal Article

metadata version: 2020-05-21

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Junhui Li, Qing Tian, Haoliang Zhang, Xinxin Chen, Xiaohe Liu, Wenhui Zhu:
Study on Dipping Mathematical Models for the Solder Flip-Chip Bonding in Microelectronics Packaging. IEEE Trans. Ind. Informatics 14(11): 4746-4754 (2018)

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