"An Electromechanical Model and Simulation for Test Process of the Wafer Probe."

Junhui Li et al. (2017)

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DOI: 10.1109/TIE.2016.2615273

access: closed

type: Journal Article

metadata version: 2022-10-02

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Junhui Li, Hailong Liao, Dasong Ge, Can Zhou, Chengdi Xiao, Qing Tian, Wenhui Zhu:
An Electromechanical Model and Simulation for Test Process of the Wafer Probe. IEEE Trans. Ind. Electron. 64(2): 1284-1291 (2017)

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