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"Packaging Technology for Electronic Applications in Harsh High-Temperature ..."

Ping Hagler, Phillip Henson, R. Wayne Johnson (2011)

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DOI: 10.1109/TIE.2010.2047832

access: closed

type: Journal Article

metadata version: 2020-05-22

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Ping Hagler, Phillip Henson, R. Wayne Johnson:
Packaging Technology for Electronic Applications in Harsh High-Temperature Environments. IEEE Trans. Ind. Electron. 58(7): 2673-2682 (2011)

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