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"Optimal Thermal Actuation for Mitigation of Heat-Induced Wafer Deformation."

Daniel W. M. Veldman et al. (2021)

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DOI: 10.1109/TCST.2019.2948592

access: closed

type: Journal Article

metadata version: 2021-04-07

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  - https://dblp.org/rec/journals/tcst/VeldmanFZWBN21
Daniel W. M. Veldman, Rob H. B. Fey, Hans Zwart, Marc M. J. van de Wal, Joris D. B. J. van den Boom, Henk Nijmeijer:
Optimal Thermal Actuation for Mitigation of Heat-Induced Wafer Deformation. IEEE Trans. Control. Syst. Technol. 29(2): 514-529 (2021)

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