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"Voltage Skew-Based Test Technique for Pre-Bond TSVs in 3-D ICs."
Jun Liu et al. (2024)
- Jun Liu, Zhi Chen, Tian Chen, Xi Wu, Huaguo Liang, Xiaohui Yuan:
Voltage Skew-Based Test Technique for Pre-Bond TSVs in 3-D ICs. IEEE Trans. Circuits Syst. II Express Briefs 71(8): 3930-3934 (2024)
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