"FPIA: Communication-Aware Multi-Chiplet Integration With ..."

Bo Jiao et al. (2024)

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DOI: 10.1109/TCSI.2024.3419579

access: closed

type: Journal Article

metadata version: 2025-04-01

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Bo Jiao, Lei Xu, Xinyu Yu, Haitao Yang, Haozhe Zhu, Yu Wang, Jundong Zhu, Dexin Wen, Lingli Wang, Jun Tao, Chixiao Chen, Yinhe Han, Qi Liu, Ninghui Sun, Ming Liu:
FPIA: Communication-Aware Multi-Chiplet Integration With Field-Programmable Interconnect Fabric on Reusable Silicon Interposer. IEEE Trans. Circuits Syst. I Regul. Pap. 71(9): 4156-4168 (2024)

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