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"FPIA: Communication-Aware Multi-Chiplet Integration With ..."
Bo Jiao et al. (2024)
- Bo Jiao, Lei Xu, Xinyu Yu, Haitao Yang, Haozhe Zhu, Yu Wang, Jundong Zhu, Dexin Wen, Lingli Wang, Jun Tao, Chixiao Chen, Yinhe Han, Qi Liu, Ninghui Sun, Ming Liu:
FPIA: Communication-Aware Multi-Chiplet Integration With Field-Programmable Interconnect Fabric on Reusable Silicon Interposer. IEEE Trans. Circuits Syst. I Regul. Pap. 71(9): 4156-4168 (2024)
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