Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"On Hamming Product Codes With Type-II Hybrid ARQ for On-Chip Interconnects."

Bo Fu, Paul Ampadu (2009)

> Home

Details and statistics

DOI: 10.1109/TCSI.2009.2026679

access: closed

type: Journal Article

metadata version: 2020-05-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/tcas/FuA09
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tcas/FuA09
Bo Fu, Paul Ampadu:
On Hamming Product Codes With Type-II Hybrid ARQ for On-Chip Interconnects. IEEE Trans. Circuits Syst. I Regul. Pap. 56-I(9): 2042-2054 (2009)

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.