"Fast 3-D Thermal Simulation for Integrated Circuits With Domain ..."

Wenjian Yu et al. (2013)

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DOI: 10.1109/TCAD.2013.2273987

access: closed

type: Journal Article

metadata version: 2021-10-14

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Wenjian Yu, Tao Zhang, Xiaolong Yuan, Haifeng Qian:
Fast 3-D Thermal Simulation for Integrated Circuits With Domain Decomposition Method. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 32(12): 2014-2018 (2013)

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