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"Integrated circuit substrate coupling models based on Voronoi tessellation."

Ivan L. Wemple, Andrew T. Yang (1995)

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DOI: 10.1109/43.476576

access: closed

type: Journal Article

metadata version: 2020-09-24

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  - https://dblp.org/rec/journals/tcad/WempleY95
Ivan L. Wemple, Andrew T. Yang:
Integrated circuit substrate coupling models based on Voronoi tessellation. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 14(12): 1459-1469 (1995)

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