"Prebond Testing and Test-Path Design for the Silicon Interposer in 2.5-D ICs."

Ran Wang et al. (2017)

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DOI: 10.1109/TCAD.2016.2629422

access: closed

type: Journal Article

metadata version: 2020-09-24

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Ran Wang, Zipeng Li, Sukeshwar Kannan, Krishnendu Chakrabarty:
Prebond Testing and Test-Path Design for the Silicon Interposer in 2.5-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36(8): 1406-1419 (2017)

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