"Post-Bond Interconnect Test and Diagnosis for 3-D Memory Stacked on Logic."

Mottaqiallah Taouil et al. (2015)

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DOI: 10.1109/TCAD.2015.2432142

access: closed

type: Journal Article

metadata version: 2024-02-05

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Mottaqiallah Taouil, Mahmoud Masadeh, Said Hamdioui, Erik Jan Marinissen:
Post-Bond Interconnect Test and Diagnosis for 3-D Memory Stacked on Logic. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 34(11): 1860-1872 (2015)

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