"Physically based simulation of electromigration-induced degradation ..."

Valeriy Sukharev (2005)

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DOI: 10.1109/TCAD.2005.852061

access: closed

type: Journal Article

metadata version: 2020-09-24

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Valeriy Sukharev:
Physically based simulation of electromigration-induced degradation mechanisms in dual-inlaid copper interconnects. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 24(9): 1326-1335 (2005)

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