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"Efficient Thermal via Planning Approach and Its Application in 3-D ..."

Zhuoyuan Li et al. (2007)

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DOI: 10.1109/TCAD.2006.885831

access: closed

type: Journal Article

metadata version: 2020-09-24

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  - https://dblp.org/rec/journals/tcad/LiHZZBYYPC07
Zhuoyuan Li, Xianlong Hong, Qiang Zhou, Shan Zeng, Jinian Bian, Wenjian Yu, Hannah Honghua Yang, Vijay Pitchumani, Chung-Kuan Cheng:
Efficient Thermal via Planning Approach and Its Application in 3-D Floorplanning. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 26(4): 645-658 (2007)

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