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"Impact of stress-induced backflow on full-chip electromigration risk ..."

Haldun Haznedar et al. (2006)

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DOI: 10.1109/TCAD.2005.855941

access: closed

type: Journal Article

metadata version: 2020-09-24

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  - https://dblp.org/rec/journals/tcad/HaznedarGZKOP06
Haldun Haznedar, Martin Gall, Vladimir Zolotov, Pon Sung Ku, Chanhee Oh, Rajendran Panda:
Impact of stress-induced backflow on full-chip electromigration risk assessment. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 25(6): 1038-1046 (2006)

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