"Placement of Thermal Vias in 3-D ICs Using Various Thermal Objectives."

Brent Goplen, Sachin S. Sapatnekar (2006)

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DOI: 10.1109/TCAD.2006.870069

access: closed

type: Journal Article

metadata version: 2020-09-24

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Brent Goplen, Sachin S. Sapatnekar:
Placement of Thermal Vias in 3-D ICs Using Various Thermal Objectives. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 25(4): 692-709 (2006)

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