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"Self-Aligned Double Patterning-Aware Detailed Routing With Double Via ..."

Yixiao Ding, Chris Chu, Wai-Kei Mak (2018)

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DOI: 10.1109/TCAD.2017.2712660

access: closed

type: Journal Article

metadata version: 2020-09-24

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  - journals/tcad/DingCM18
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Yixiao Ding, Chris Chu, Wai-Kei Mak:
Self-Aligned Double Patterning-Aware Detailed Routing With Double Via Insertion and Via Manufacturability Consideration. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 37(3): 657-668 (2018)

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