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"Novel Spare TSV Deployment for 3-D ICs Considering Yield and Timing ..."

Yu-Guang Chen et al. (2015)

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DOI: 10.1109/TCAD.2014.2385759

access: closed

type: Journal Article

metadata version: 2022-12-13

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Yu-Guang Chen, Wan-Yu Wen, Yiyu Shi, Wing-Kai Hon, Shih-Chieh Chang:
Novel Spare TSV Deployment for 3-D ICs Considering Yield and Timing Constraints. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 34(4): 577-588 (2015)

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