"Thermal Sensor Placement for Multicore Systems Based on Low-Complex ..."

Kun-Chih Chen et al. (2022)

> Home

Details and statistics

DOI: 10.1109/TCAD.2022.3143476

access: closed

type: Journal Article

metadata version: 2022-11-13

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/tcad/ChenTWC22
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tcad/ChenTWC22
Kun-Chih Chen, Hsueh-Wen Tang, Chi-Hsun Wu, Chia-Hsin Chen:
Thermal Sensor Placement for Multicore Systems Based on Low-Complex Compressive Sensing Theory. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41(11): 5100-5111 (2022)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.