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"The intertool profile interchange format: an object-oriented approach ..."

Duane S. Boning, Michael L. Heytens, Alexander S. Wong (1991)

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DOI: 10.1109/43.85761

access: closed

type: Journal Article

metadata version: 2020-09-24

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  - journals/tcad/BoningHW91
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  - https://dblp.org/rec/journals/tcad/BoningHW91
Duane S. Boning, Michael L. Heytens, Alexander S. Wong:
The intertool profile interchange format: an object-oriented approach [semiconductor technology CAD/CAM]. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 10(9): 1150-1156 (1991)

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