"Impact of Mechanical Stress on the Full Chip Timing for ..."

Krit Athikulwongse et al. (2013)

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DOI: 10.1109/TCAD.2013.2237770

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type: Journal Article

metadata version: 2022-10-02

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Krit Athikulwongse, Jae-Seok Yang, David Z. Pan, Sung Kyu Lim:
Impact of Mechanical Stress on the Full Chip Timing for Through-Silicon-Via-based 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 32(6): 905-917 (2013)

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